Ayat Power Update Fb. CAPABILITY: JEDEC tray input/output Accuracy +/- 10 µm @ 3 sigma, cpk 1.33 Theta axis rotary bond head 0˚ to 360˚ increments 0.0045˚ Theta placement accuracy +/- 0.15˚ @ 3 sigma Automatic calibration function corrects thermal changes over time Multi-chip placement in one single pass capability Picking from wafer ( 4 to 12 in.) on 12 in. Frame (Or waffle pack / GEL PAK ( 2 x 2 in.) Wafer table with stretcher 7 positions automatic tool changer unit SECs/GEM capability Wafer scanner and electronic wafer mapping capable Pattern recognition system with edge, gray level, pattern and ink dot Wafer size 50 to 300 mm Frame size 375 mm Die size 0.5 mm to 50 mm Die thickness 0.05 to 7 mm.

2200 evo -2200 evo plus. Datacon Datacon Fico Meco Fico New 8. Vpnium Keygen. •Besi has full range of AP systems. 2014E revenue. 2200 evo -2200 evo plus. Datacon Datacon Fico Meco Fico New 8. •Besi has full range of AP systems. 2014E revenue.